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  july 2014 docid026151 rev 2 1 / 7 www.st.com ev - vn7140as vn7140as evaluation board data brief features max transient supply voltage v cc 40 v operating voltage range v cc 4 to 28 v typ. on - state resistance (per ch) r on 140 m current limitation (typ) i limh 12 a stand - by cu rrent (max) i stby 0.5 a ? simple single ic application board dedicated for vn7140as - e ? provides electrical connectivity and thermal heat - sinking for easy prototyping ? general device features ? single channel smart high side driver with analog feedback ? very low standby current ? compatible with 3 v and 5 v cmos outputs ? diagnostic functions ? dedicated high precision proportional load current sense ? overload and short to ground (power limitation) indication ? thermal shutdown indication ? off - state open - load detection ? output short to v cc detection ? sense enable/disable ? protections ? undervoltage shutdown ? overvoltage clamp ? load current limitation ? self limiting of fast thermal transients ? loss of ground and loss of v cc ? reverse battery with external components ? electrostatic d ischarge protection applications typical applications are all types of automotive resistive, inductive and capacitive loads. description this board provides you an easy way to connect stmicroelectronics ? vipower ? m0 - 7 technology into your existing system. table 1: device summary order code reference ev - vn7140as vn7140as evaluation board
overview ev - vn7140as 2 / 7 docid026151 rev 2 1 overview it comes pre - assembled with vn7140as - e high - side driver. on board minimum set of electrical components (as for device datasheet recommendation) is enabling the user to directly connect the load, the power supply and the microcontroller without any additional effort in external component design and connection. the vn7140as - e is a single channel high - side driver manufactured using st proprietary vipower ? technology and housed in so - 8 package. the device is designed to drive 12 v automotive grounded loads through a 3 v and 5 v cmos - compatible inte rface and to provide protection and diagnostics. the device integrates also advanced protective functions such as load current limitation, overload active management by power limitation and overtemperature shutdown. a dedicated high precision proportional load current sense is available, in addition to the detection of overload and short circuit to ground, short to v cc and off - state open - load. a sense enable pin allows off - state diagnosis to be disabled during the module low - power mode as well as external s ense resistor sharing among similar devices. figure 1 : evaluation board schematic 1 2 3 4 5 6 7 8 9 1 0 j4 1 2 3 4 5 6 7 8 9 1 0 j1 vbat vbat c1 100nf pgnd pgnd d1 es1d l out led 1 2 j2 c2 10nf r8 2k2 r7 4k7 r3 15k +5v 1 2 3 4 5 6 7 8 9 10 1 1 12 13 14 15 16 17 18 j3 con18 in s_en multisense r1 15k i n rsense multisense s_en r6 15k cext 1 tp2 1 tp1 sen 2 gnd 3 inpu t 1 vcc 8 outpu t 7 outpu t 6 vcc 5 multisense 4 u1 so-8 vbat vbat r_u p in_pullu p in_pullu p pgnd pgnd pgnd pgnd pgnd
ev - vn7140as board connections docid026151 rev 2 3 / 7 2 board connections figure 2: "evaluation board connections" shows the placement of the connectors to be used for supplying the evaluation board, connecting the load and controlling the functionality and diagnostic of the device. figure 2 : evaluation board conn ections table 2: j3 connector: pin functions connector pin number pin name pin function j3 14 n/a not connected j3 5 in_pullup connection to optional external pull - up resistor for open load detection in off - state. j3 6 +5v 5 v power supply j3 7 n/a not connected j3 8 multisense current sense pin: it delivers a current proportional to load current j3 9 s_en active high compatible with 3 v and 5 v cmos outputs pin; it enables the multisense diagnostic pin. j3 1012 n/a not connected j3 13 in voltage controlled input pin with hysteresis, compatible with 3 v and 5 v cmos outputs. it controls out switch state. j3 1418 n/a not connected in case the user wishes to utilize the current sense/multisense function of the device, it is necessary to plug a sense resistor in r sense . the package includes a through - hole resistor, to be mounted on tp1 - tp2 (see figure 4: "mounting through - hole sense resistor" ). different r sense values can be adopted based on user preference .
board connections ev - vn7140as 4 / 7 docid026151 rev 2 another option is soldering an smd resistor on the dedicated pcb pad, as shown in figure 5: "pads for soldering smd resistor" . figure 3 : no sense resistor figure 4 : mou nting through - hole sense resistor figure 5 : pads for soldering smd resistor
ev - vn7140as thermal data docid026151 rev 2 5 / 7 3 thermal data table 3: thermal data symbol parameter max unit r thj - amb thermal resistance junction - ambient (max) 64 c/w table 4: pcb specifications parameter value board dimensions 25 mm x 41.5 mm number of cu layer 2 layer cu thickness 35 m board finish thickness 1.6 mm +/ - 10% board material fr4 thermal vias separation 1.1 mm thermal vias diameter 0.5 mm
revision history ev - vn7140as 6 / 7 docid026151 rev 2 4 revision history table 5: revision history date revision changes 10 - apr - 2014 1 initial release. 21 - jul - 2014 2 updated section "features"
ev - vn7140as docid026151 rev 2 7 / 7 important notice C please read carefully stmicroelectronics nv and its subsidiaries (st) reserve the right to make changes, corrections, enhancements, modifications , and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant information on st products before placing orders. st products are sold pursuant to sts terms and conditions of sale in place at the time of or der acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and s t assumes no liability for application assistance or the design of purchasers products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information se t forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2014 stmicroelectronics C all rights reserved


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